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Influence of Process Parameters on the Properties of TiO_2 Films Deposited by a D.C. Magnetron Sputtering System on Glass Support

机译:工艺参数对D.C.磁控溅射系统沉积的TiO_2膜性能的影响

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In this paper it has been deposited films of titanium oxide (TiO_2), on a support of glass, by a D.C. magnetron sputtering system, by varying the working pressure (p = 2-10~(-3) - 6.5-10~(-3)mbar) of the substrate temperature on three levels. The obtained layers were investigated and characterized by optical microscopy, Scanning Electron Microscopy SEM, X-ray diffraction and Atomic Force Microscopy. It was observed that, by modifying technological parameters of the process (working pressure and substrate temperature) it is changing the initial orientation of the compounds ((100) turns into (101) or (002)). The AFM analysis has allowed the observation of the fact that the average roughness of deposited films, expressed as RMS, has increased over 98% at the increasing of sputtering pressure from 2 10~(-3)mbar to 6.5 10~(-3)mbar. SEM analysis showed that the density of the deposit increases with substrate temperature. The granulation of the films obtained, presents an increasing trend with the variation of process parameters.
机译:本文通过改变工作压力(P = 2-10〜(-3) - 6.5-10〜(〜5),已经通过DC磁控管溅射系统沉积在玻璃的氧化钛(TiO_2)的薄膜上沉积氧化钛(TiO_2)的薄膜(P = 2-10〜(3) - 6.5-10〜( -3)μBar)底物温度为三个水平。通过光学显微镜研究并表征所得到的层,扫描电子显微镜SEM,X射线衍射和原子力显微镜。观察到,通过改变过程的技术参数(工作压力和基板温度),改变化合物的初始取向((100)变成(101)或(002))。 AFM分析允许观察沉积薄膜的平均粗糙度,表示为RMS的溅射压力的增加超过98%,从2 10〜(3)毫巴增加到6.5 10〜(-3) mbar。 SEM分析表明,沉积物的密度随衬底温度而增加。获得的薄膜的造粒呈上升趋势随工艺参数的变化。

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