• 主题
高级搜索  >
历史搜索 清空历史
首页> 外文会议>Conference on enabling photonic technologies for aerospace applications >Next-generation optoelectronic components enabled by direct-write microprinting technology
【24h】

Next-generation optoelectronic components enabled by direct-write microprinting technology

机译：直接写入微型技术实现的下一代光电元件

获取原文
页面导航
  • 摘要
  • 著录项
  • 相似文献
  • 相关主题

摘要

Direct write microprinting technologies are now being developed and used across a wide spectrum of optoelectronic applications, because they provide opportunities for manufacturing a series of components in micrometer scales and in large array size with reduced cost. Micro-optic structures have been printed not only as stand-alone components, but also directly onto other active and passive components, such as VCSEL, photodiode, optical fiber, etc., to form high performance assemblies. These assemblies can be further integrated with electronic circuits via solder ball printing to construct miniature and high sensitivity sensing devices, such as photodiode array detector, fluorescence probe, etc. By implementing MEMS technologies, micro-clampers have also been developed for the alignment and packaging of miniature, multi-channel sensing devices.
机译：目前正在开发直接写入微型技术，并在广泛的光电应用方面开发并使用，因为它们为制造了一系列微米尺度和大的阵列尺寸的机会，具有降低的成本。微光学结构不仅打印为独立的组件，也可直接印刷到其他主动和无源部件（例如VCSEL，光电二极管，光纤等）上，以形成高性能组件。这些组件可以通过焊球印刷进一步与电子电路集成，以构建微型和高灵敏度感测装置，例如光电二极管阵列检测器，荧光探针等。通过实现MEMS技术，还开发了用于对准和包装的微夹钳微型，多通道传感装置。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱：kefu@zhangqiaokeyan.com

京公网安备：11010802029741号 ICP备案号：京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有

  • 客服微信

  • 服务号