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Thermal chuck for holding test devices such as integrated circuits for carrying out low voltage and low power tests at varying temperatures has a capacitative connection for filtering out electrical noise
Thermal chuck for holding test devices such as integrated circuits for carrying out low voltage and low power tests at varying temperatures has a capacitative connection for filtering out electrical noise
Thermal chuck comprises a chuck for holding the test device, a thermal unit for altering the chuck temperature, a controller that powers the thermal unit and a conductor which is coupled via a capacitor with the thermal unit but which has no direct connection to the unit. Conductor and controller are connected so that all thermal unit capacitative currents can be fed back to the controller.
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